132 132 spef 1.5mm-travel vertical type surface mountable lead-free soldering push switch spef120200 japan export non shorting pc board 2.7 latching alternate spef210101 spef110100 spef210200 spef110200 3n 5n 3n 5n 1. 5 ? reflow dip reflow dip reflow dip reflow dip 1 2 1 2 1 2 1 2 1, 3 2 0 660 4,200 1, 0 5 0 1, 3 2 0 660 4,200 1, 0 5 0 spef220100 1, 3 2 0 660 spef120100 4,200 1, 0 5 0 SPEF220200 1, 3 2 0 660 4,200 1, 0 5 0 operating force travel mm changeover timing terminal type operating product no. product line mounting method total travel mm drawing no. minimum order unit pcs. refer to p.138 for soldering conditions. typical specifications items specifications rating max./min. resistive load 1a 14.5v dc / 50a 3v dc contact resistance initial / after operating life 100m max. / 100m max. operating force 3n, 5n operating lifewith load 30,000 cycles 1a 14.5v dc poles-position 1-pole, 2-position product no. number of packages pcs. tape width mm export package measurementsmm 1 reel 1 case / japan 1 case / export packing spef210101 spef210200 spef220100 SPEF220200 16 5 660 1, 3 2 0 32 4 034 03360 tray product no. number of packages pcs. export package measurementsmm 1 case / japan 1 case / export packing spef110100 spef110200 spef120100 spef120200 1, 0 5 0 4,200 5 4 0360230 unit:mm reel size packing specifications taping ? 380 33.5 horizontal type vertical type detector slide push rotary power dual-in-line package type
133 133 spef1.5mm-travel vertical type pc board mounting hole dimensions viewed from the direction a circuit diagram viewed from direction a 1 2 c no. 1 2 refow soldering type dimensions unit:mm style dip soldering type 1.2 1.2 2.1 2.1 2 4.6 2.5 13.6 9.4 3.5 ?1.4 14.6 1.3 6.9 13.1 11.86 6 2.52.5 2.5 11.3 3.5 9 6.7 terminal no. 1 terminal no. 2 terminal no. c ?0.9 full stroke position lock position a 3.5 9.4 2.5 ?1.4 ?0.9 14.6 1.3 9.8 12.2 3.2 3.5 13.1 6.9 11.86 6 1.2 1 1 3.5 2.5 2.52.5 9 5.7 6.7 terminal no. c terminal no.1 terminal no.2 pc board mounting face lock position full stroke position a horizontal type vertical type detector slide push rotary power dual-in-line package type
115 115 vertical type series vertical spef sped2 sped3 sped4 sped5 photo dimensions mm w 9.4 14 13 . 5 d 9 16 . 8 18 18 . 2 h 6.9 18 . 3 16 . 9 7 13 .1 18 travel mm 1. 5 total travel mm 2.7 4.5 3.8 number of poles 1 1 2 1 operating temperature range ?40 to 85 ?40 to 95 automotive use life cycle rating max. resistive load 1a 14 . 5 v d c 2 a 14 . 5 v d c rating min. resistive load 50a 3v d c durability operating life without load operating life with load at max. rated load 30,000 cycles 100m max. electrical performance initial contact resistance 10 0 m m a x . insulation resistance 3 m m i n . 10 0 v d c 3m min. 500v dc voltage proof 10 0 v a c f o r 1m i n u t e mechanical performance terminal strength wire strength 30n actuator strength operating direction 90n 98n 90n 98n pulling direction 30n environmental performance cold ?40 96h dry heat 85 96h 85 96h (connector type) 105 192h (dip type) 10 5 19 2 h damp heat 40, 9 0 to 95%rh 96h page 13 2 13 4 13 6 push switches soldering conditions ??????????????????????????????????????????????? 138 push switches cautions ????????????????????????????????????????????????????? 139 note indicates applicability to all products in the series. horizontal type detector slide push rotary power dual-in-line package type
138 138 horizontal type vertical type soldering time speh series series example of reflow soldering condition 1. heating method: double heating method with infrared heater. 2. temperature measurement: thermocouple 0.1 to 0.2 ca (k) or cc (t) at soldering portion (copper foil surface). a heat resisting tape should be used for fixed measurement. 3. temperature profile 300 200 100 a max. b e d time (s) c pre-heating f max. room temperature temperature (?c ) 1. the condition mentioned above is the temperature on the mounting surface of a pc board. there are cases where the pc board's temperature greatly differs from that of the switch, depending on the pc board's material, size, thickness, etc. the above-stated conditions shall also apply to switch surface temp eratures. 2. soldering conditions differ depending on reflow soldering machines. pri or verification of soldering condition is highly recommended. notes 260 seriesreflow type 230 40 18 0 15 0 12 0 speg spej spef a 3s max. b cs d e fs 10 1s soldering temperature duration of immersion preheating temperature preheating time sppj2, spph1, sped2, sped4, spef spuj, spph2, spph4 spun sppj3 10 0 m a x . 60s max. 2605 5 1s 10 0 m a x . 60s max. 2605 10 1s 2605 5 1s 2605 items dip soldering reference for dip soldering (for pc board terminal types) 3 0 0 10 spuj 3 +1/ 0 s 350 max. speh , spph2 speg, spef spej sped2, sped4 sppj3, sppj2, spun, spph4, spph1 3 5 0 10 3 +1/ 0 s 3 5 0 10 30.5s 3 5 0 10 4s max. 3505 3s max. 3s max. soldering temperature reference for hand soldering for pc board??m push switches soldering conditions detector slide push rotary power dual-in-line package type
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